Cooler Master Thermal Pad 2.0 mm
- Formulated with Nano Elements: Nano zinc oxide and nano alumina particles deliver a thermal conductivity of 13.3 w/mK for rapid cooling, suitable for a wide range of electronics and devices.
- Non-toxic and Non-corrosive: Safe and simple formula with electrically insulated and heat resistant properties to prevent hardening
- Double-sided Adhesive: Provides seamless and secure contact between surfaces
- Versatile and Easy Application: Easily cut to the perfect size for your application
$26 exc. VAT
THERMAL PAD
Cooler Master’s new Thermal Pad is an innovative solution to device cooling for a vast range of your electronic devices and components.
FORMULATED WITH NANO ELEMENTS
13.3w/mK thermal conductivity for rapid cooling, capable of drawing high levels of heat.
NON-TOXIC AND NON-CORROSIVE
Safe and simple formula with electrically insulated and heat resistant properties to prevent hardening.
DOUBLE-SIDED ADHESIVE
Provides seamless and secure contact between surfaces.
WIDE RANGE OF APPLICATION
Electronic devices, motherboards, components (CPU, GPU, USICS, Hard Drives,
Disk Drives, IGBT module), laptops and various products requiring cooling.
Dimensions (L x W x H) 95 x 45 mm
Thermal Conductivity 13.3 (W/m.K)
Color Purple
Density 3.4 ± 0.2 g/cc
Hardness 30~60 Sc
Breakdown Voltage 6KV (1mm)
Working Temperature -40 ~ 200°C
Cooler Type Thermal Grease
