COOLER MASTER THERMAL PAD 2.0mm
- FORMULATED WITH NANO ELEMENTS – 13.3w/mK thermal conductivity for rapid cooling, capable of drawing high levels of heat.
- NON-TOXIC AND NON-CORROSIVE – Safe and simple formula with electrically insulated and heat resistant properties to prevent hardening.
- DOUBLE-SIDED ADHESIVE – Provides seamless and secure contact between surfaces.
- VERSATILE AND EASY APPLICATION – Easily cut to the perfect size for your application.
- WIDE RANGE OF APPLICATION – Electronic devices, motherboards, components (CPU, GPU, USICS, Hard Drives, Disk Drives, IGBT module), laptops and various products requiring cooling.
$26 exc. VAT
THERMAL PAD
Cooler Master’s new Thermal Pad is an innovative solution to device cooling for a vast range of your electronic devices and components.
FORMULATED WITH NANO ELEMENTS
13.3w/mK thermal conductivity for rapid cooling, capable of drawing high levels of heat.
NON-TOXIC AND NON-CORROSIVE
Safe and simple formula with electrically insulated and heat resistant properties to prevent hardening.
DOUBLE-SIDED ADHESIVE
Provides seamless and secure contact between surfaces.
WIDE RANGE OF APPLICATION
Electronic devices, motherboards, components (CPU, GPU, USICS, Hard Drives, Disk Drives, IGBT module), laptops and various products requiring cooling.
Dimensions (L x W x H) – 95 x 45 mm
Thermal Conductivity – 13.3 (W/m.K)
Density – 3.4 ± 0.2 g/cc
Hardness – 30~60 Sc
Breakdown Voltage – 6KV (1mm)
Working Temperature – -40 ~ 200°C
